Physical Vapor Deposition (PVD) is a process where materials are vaporized from a source (target) and then transported through a vacuum to be deposited on the part. The thickness of the coating is typically 1-5 µm.Cathodic Arc Technology
An "evaporative" process offering a wide range of coverage for coating complex geometry. The system utilizes a "Line of Sight" coating method which requires that the part is presented directly in front of the cathode (target material being applied). An electric arc vaporizes the material into a plasma state and it is then deposited on the part substrate. High energy at the surface ensures a strong mechanical bond and an increase in overall "toughness" of the thin film. The majority of "Functional Coatings" are applied using this technology. Common materials applied include Titanium (Ti); Zirconium (Zr); Chromium (Cr) and Aluminum Titanium (AlTi) to name a few.
This coating process physically deposits particles extracted from the target surface by ejecting the particles towards the part substrate. Sputtering sources are "magnetrons" that utilize strong electric and magnetic fields to trap electrons close to the magnetron (target). The electrons follow a helical path around the magnetic field and are deposited as the part moves by the target. The end result is a smoother, more uniform film deposit and tighter grain structure. Common materials applied include Titanium (Ti); Zirconium (Zr); Chromium (Cr); Gold (Au) and Silver (Ag).